RJI TECHNICAL SALES is a consultative,
manufacturer's technical sales representative
firm supporting the semiconductor industry.


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Some words about



SHT
Smart High Tech



GT Series Thermal Interface Material



sheet materials



Our GT-Series product range includes our new invention for Thermal Interface Material (TIM) with multiple beneficial features:


Two-axis thermal conducting path • Hybrid TIM and heatspreader


Easy-to-use


“Instant Attach”, “Reflow” or “Curable” versions available


Extremely high through-plane thermal conductivity (350-1000W/mK), 10-100 times higher than competitors


Electrically insulating and thermally conducting versions available


Connect to GT Series data sheets

GT Series Thermal Interface Material



sheet materials



Our GT-Series product range includes our new invention for Thermal Interface Material (TIM) with multiple beneficial features:


Two-axis thermal conducting path • Hybrid TIM and heatspreader


Easy-to-use


“Instant Attach”, “Reflow” or “Curable” versions available


Extremely high through-plane thermal conductivity (350-1000W/mK), 10-100 times higher than competitors


Electrically insulating and thermally conducting versions available


Connect to GT Series data sheets

GF Series Thermal Interface Material



Sheet Material



GF product is a cohesive, flexible sheet which provides high thermal conductivity along x-y plane. GF is light-weight compared with conventional heat spreader material, Al and Cu. The excellent flexibility of GF is able to conform well to the surfaces under low contact pressure. GF is an ideal choice for thermal management, heat spreader and especially to eliminate localized hot spots in electronics components.


Excellent thermal conductivity: 1000 to 3200 W/(mK) Light-weight: Specific gravity 0.4 to 2.1 g/cm3

Stability: Withstand temperature up to 400°C

Flexible: And easy-to-use


Connect to GF Series data sheets

WORLD LEADING SUPPLIER OF GRAPHENE BASED COOLING PRODUCTS



State-of-the-art graphene based thermal
interface materials supplier



The evolution of electronic devices means they need to have increased functionality and performance in a smaller space. For example power densities are expected to increase to more than 600 W/cm2 until 2024 for single-chip packages. At the same time the heat generated by electronic devices and their circuitry must be dissipated in order to assure reliability and prevent premature failure. The core material used by SH: graphene, possesses excellent electrical, mechanical, thermal and electrochemical properties. Which means that our products can keep up with the evolution of electronic devices and assure efficient cooling. We offer custom tailor-made process know-how for graphene-based cooling products, in particular, graphene based thermal interface materials (TIM). We can help you to improve your material or system performance by finding the right way to use graphene.


Connect with SHT application information

6 Doyers St
New York, NY 10013


CALL: 212-555-1212



RJI TECHNICAL SALES
Your source for test and burn-in solutions!