OKINS
Electronics Co. Ltd.

OKins high performance wafer-level CSP test socket provides fine pitch (0.15mm) and quick design solution. Device pitch: MIN 0.15mm and above Spring probes: 4-point crown, Flat crown, Pointed needle, etc Probe compliance: 0.2mm and above Spring force: 5gf and above Contact Resistance: 30mOhms ~ 150 m ohms Socket body: engineering plastics Lead time: 2 weeks

For high pin and fine pitch burn-in solutions, the thermal sockets are offering to the requirements on heat acceleration testing. Okins has full line-up of thermal sockets with various designs. Socket Basic Concepts Passive and active thermal control during burn-in test → Individual chip temperature control Heat sink design optimization for heat dissipation solution High contact performance & competitive solution Thermal solution for mid & high power range temp High confidence in burn-in effectiveness Socket Features Clamshell socket with various lid design Compression surface mount Spring probes and stamped contacts Various pitches available Optional heat sink and fan attached Socket materials of PEI and equivalent.