Manufacturers

FOR OVER 25 YEARS INNOVATIVE CIRCUITS ENGINEERING, INC. HAS BEEN PROVIDING RELIABILITY TESTING, ESD TESTING AND FAILURE ANALYSIS SERVICES FOR ESTABLISHED AND STARTUP ORGANIZATIONS IN THE UNITED STATES AND AROUND THE GLOBE. ​

Peak Automation designs and manufactures automated equipment to meet our customer’s needs for small component handling solutions.

Our specialty is providing turn-key solutions for custom applications and custom process integration, such as automated test handlers.

ABACITE TEST SOLUTIONS is a manufacturer of small engineering and reliability chambers for burn-in and test applications. Chambers are designed for reliability engineering departments, product engineering and new product development teams.

ABACITE is committed to quality, customer satisfaction and delivery of superior oven products. ABACITE provides a ideal environment for development of unique solution driven products and services. Products are USA designed and manufactured.

ELDROTEC is focused on Innovative Thermal solutions, R&D, engineering and manufacturing of cooling and heating systems with precise temperature management and control.

ELDROTEC serves the medical, military and semiconductor markets.

MiS Technologies’ Clam-shell type sockets are uniquely designed, and feature a miniature 16mm×7mm overall body size for a wide variety of different electronic devices such as Oscillators, X-tal, SAW filters, Capacitors, MEMS, Sensors and Semiconductor devices, 500 different variations are available to meet worldwide demands. According to our research, MIS is the industry leader of Clam-shell style sockets.

MiS Technologies’ sockets are used extensively in Japan, Taiwan, South Korea, China, America, EU, Russia and other countries.

MicroXact’s mission is to identify significant technological problems, apply novel science and engineering to generate innovative solutions, and aggressively pursue commercial opportunities in which these solutions can be implemented.

Employee-owned and intensely driven, MicroXact is uniquely positioned to integrate multi-disciplinary backgrounds and extensive networking with the end goal of providing high-impact products to industrial, military and consumer markets.

IC's extreme complicated integration and multistack technology makes failure mode diversify. On the other hands, The demand for Failure Analysis method is more shorten time and definitely, also require low risk and low cost. IC Decapsulation is the preparation working to remove the resistance material where locates the failure needed to confirm and investigate. NSC has been developed suitable system for various IC's opening requirements and then listed test equipments and contract decap service since NSC founded in 1987. Today, these equipments have been used in worldwide customer and NSC has credibility of decap solution through the business of EDlab. NSC is continuing to try for supporting the present scene of failure analysis.